Quad flat no lead qfn application note and best practices objective the purpose of this application note and best practices guide is to describe the qfn type component and provide testing methodology and best practices to ensure robust testing and quality results. Reproduction of information in ti data books or data sheets is permissible only. With the spurt in growth of consumer driven smart phones market and significant resources invested in internet of things iot where both form factor and cost play a major role, there is a need for packaging solution. Assembly guidelines for qfn quad flat no lead and son small outline no lead packages rev. Dec 04, 2015 a new configurable sintered interconnect qfn package for high performance, high lead count and low cost applications abstract. The qfn can have a single or a multiple rows of pins. Configurable sintered interconnect csi for semiconductor. The quad flat pack no leads qfn style of leadless packaging also. In the last stage of the manufacturing process, the lead frame is moulded in a plastic case, and outside of the lead frame is cutoff, separating all leads. Unfortunately, i have escape vias underneath that device, and they were not tented on top. The frameless stencils are designed to work with stencil tensioning systems known as reusable stencil frames an example being vectorguard. Interconnect signal and power integrity sipi thermal management.
Master lead frame designer mlfd by cad design software. Ic lead frame materials overview sealing materials are used widely in the production of electron tubes, transistors, integrated circuits, cathode ray tubes, etc. The economic manufacture of lead frames a technical. Careful routing and design may be required to ensure that none of the design rules is violated. Ishikawa diagram for qfn wire bond process quality qfn wire bond quality material method machine man capillary selection gold wire selection lead frame design tape selection transducer frequency ppart design indexing and clamping methods looping modes. Generally, lead frame based packages such as qfn offer the most competitive cost structure and is suitable for medium io applications, the technology, however, is constrained by having only fanout capability, insufficient design layout flexibility and relatively higher parasitics. Csi technology frame is a more rigid platform for qfn and other packaging solutions. Sealing materials must have thermal expansion coefficients that correspond over a wide temperature range to those of glass and ceramics to which they are applied. Dualrow qfn packages have interstitial, staggered contacts. Except for the metal lead frame we mentioned above, ase also provide design service for tape base material, include film flux, substrate, tape bga, cof, tcp, and ubga. The name leadframe or lead frame is actually very accurate. The qfn package is a near chip scale plastic encapsulated molded or air cavity package with a copper lead frame substrate, the electrical contact to pcb. This leadframe interposer is radically cheaper than conventional organic substrate and tape interposer used for csp. Qfn style packages see figure 1 are physically robust, thermally efficient, and occupy much less pcb space than equivalent qfp packages.
Ishikawa diagram framework adopted for analyzing the wirebond challenges in qfn fig a. Find qfn lead frame design rules related suppliers, manufacturers, products and specifications on globalspec a trusted source of qfn lead frame design rules information. The advanced drc software verifies all complex lead frame and wire bonding design rules. If the stencil is too thick for the size of apertures then it can lead to the paste being held by surface tension to the inner walls of the aperture. Solder paste stencil design for optimal qfn yield and. Development of a premold leadframe for multirow qfn package. Qfn lead frame exposed underneath, shorting to via under. A new configurable sintered interconnect qfn package for. Tn1257 pcb layout recommendations for qfn packages. The sheet is automatically transferred over the alignment pins of the shear drive and lowered onto the pins. Assembly and ews design rules for wire bond interconnect dice. Journal of electrical engineering, david publishing co. Most kinds of integrated circuit packaging are made by placing the silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and then covering the chip with plastic. Utacs new generation of leadframepackage design grid array qfn gqfn may 6, 2015 4 development in leadless leadframe package quad flat nolead qfn package dual row qfn.
Sealing materials are used widely in the production of electron tubes, transistors, integrated circuits, cathode ray tubes, etc. Elimination of esd events and optimizing waterjet deflash process for reduction of leakage current failures on qfnmr lead frame devices. A leadframe is a thin layer of metal that connects the wiring from tiny electrical terminals on the semiconductor surface to the largescale circuitry on electrical devices and circuit boards. Qfn microleadframe mlf lfcsp vqfn dfn amkor technology. Texas instruments ti quad flatpack nolead qfn 141620terminal pbfree plastic packages meet dimensions specified in. Molded lead frames precision plastic and optical components. Common process defect identification of qfn packages using optical and xray inspection david bernard dage precision industries. Flat noleads, also known as micro leadframe mlf and son smalloutline no leads, is a surfacemount technology, one of several package technologies that connect ics to the surfaces of pcbs without throughholes. Leadframe is an alloy frame that consists of the package leads and the paddle. The lead frame for qfn is offered by chang way industries co. Development and package characterization of advance. The cc256x qfn ic is a bluetooth rf radio device targeted to operate on commercial platforms. Our premolded packages include qfn, pdip, soic and ssop.
After wire bonding you can automatically create a full solid model that can be exported as acis or step for export to thermal analysis tools. Qfn type package is one of the most cuttingedge ic packaging technologies in the electronics. Anysilicon find asic design companies, ip cores and. Components, packaging and manufacturing technology chapter, scv section aprill 7, 2015. The intent of this application note is to provide pcb designers with a set of guidelines for successful board mounting of tagores quad flat noleads qfn packages. Design and process guidelines for qfns dfr solutions. Qfn package board level reliability project call for participation webinar project leader. On the contrary, plastic leadframe packages remain widely used.
Flat noleads packages such as quadflat noleads qfn and dualflat noleads dfn physically and electrically connect integrated circuits to printed circuit boards. Pss is familiar with and can design and implement any package type. This package is also known as quad flat nonleaded qfn, leadframe chip scale package lfcsp, microleadframe mlf, mlp, lpcc, qlp, and hvqfn. Development and package characterization of advance leadless leadframe package. The user is ultimately responsible for determining the suitability of their own design. It intelligizes existing lead frame blanks or populated lead frames from any source for subsequent processing. When the qfn package design needs to start the assembly house. Modified sidewall design of qfn package journal of.
Design and assembly process considerations for qfn type. They generally have superior lead inductance characteristics. Pss services ic packaging experts, ic package design. Refer to published reports, books, papers 410 for this category of. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as. And tis new tpsm53604 power module solves the thermal design challenge by integrating a very high efficiency ic inside a routable lead frame q fantype package. Development and package characterization of advance leadless. Apr 29, 2015 over the past 15 years, the implementation of the qfn btc package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. This document does not discuss integrated quadflat no lead. Solder paste stencil design for optimal qfn yield and reliability april 29, 2015 ben gumpert, lockheed martin. The quickest way to find any asic design companies, ip cores and service providers for asic design, verification, packaging, testing, validation and turnkey services. Ipc7526 stencil and misprinted board cleaning hand book. By continuing to browse this site, you are agreeing to our use of cookies.
Stack paper leadframe 2 level paper leadframe paper leadframe loc paper leadframe skymart epoxy leadframe skymart mold paper frame paper leadframe. Leadless quad flat pack qfn packages are plasticencaps ulated with a copper lead frame substrate, providing a robust, lowcost solution for small form factor applications such as mobile handsets and. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements. Among the most prominent of the new offerings is the qfn quad flat no lead. Elimination of esd events and optimizing waterjet deflash process for reduction of leakage current failures on qfn mr lead frame devices. Skymart paper leadframe no limit to design, beyond mold. Quad flat nolead qfn application note and best practices. Generally, leadframe based packages such as qfn offer the most competitive cost structure and is suitable for medium io applications, the technology, however, is constrained by having only fanout capability, insufficient design layout flexibility and relatively higher parasitics.
Existing packages that are currently offered solely with a pb. The lead frame sheet is picked up by the sheet transfer rack using vacuum and raised up off the stack. Procurement and quality general spec for metallic leadframe. The qfn dimensions used in the land pattern design can be taken from these drawings. Assembly guidelines for qfn quad flat nolead and son.
The quad flat nolead qfn package is a leadless nearchipscale package csp that is growing in popularity due to its compact size, reduced weight, and. Sealing materials must have thermal expansion coefficients that correspond over a wide temperature range to those of glass and ceramics to which they are. There is an increasing number of ic devices being packaged in nolead packages such as the quad flat nolead qfn or microlead frame mlf packages. This helps solve problems where component height may be a problem. Board layout and stencil information for most texas instruments ti quad flat. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as well as major military and aerospace institutions. Qn84 quadflat no lead package leadless quad flat pack qfn packages are plasticencaps ulated with a copper lead frame substrate, providing a robust, lowcost solution for small form factor applications such as mobile handsets and other battery operated consumer products. The qfn algorithm was introduced in 5dx software version 8. Quad flat nolead qfn application note and best practices objective the purpose of this application note and best practices guide is to describe the qfn type component and provide testing methodology and best practices to ensure robust testing and quality results. Recommendations for board assembly of infineon discrete. Global chip materials manufactures premolded open cavity qfn packages in standard jedec body sizes and lead counts. Lead frames are used in almost all semiconductor packages. Semiconductor qfn package with advanced interlocking design. Pss can help you select the right package for your ic, sip or discrete component.
Another advantage of this technology is the ease of design for custom. Soic8 224 units per lead frame qfn 16ld 1500 units per lead frame soic would require 200 ton press map array would require only 50 ton press clamping force required to control resin bleed. Section view of a qfn package sloa122 july 2006 qfn layout guidelines 1 submit documentation. Leadframes are used in almost all semiconductor packages. A design and manufacturing guide for the lead frame chip scale package lfcsp. Quikpak, originally founded in 1994 as spt, was purchased by delphon industries in 2000. Utilizing only substratebased etched lead frames that have been plated with nickelpalladiumgold nipdau technology, we are able to mold a variety of thermoplastics onto lead frames to form customized cavity substrates for electronic packaging.
Madera solutions llc packaging evolution fourth wave 14 high density lead frames and substrates standardized. The frame features are considerably different from the standard copper etch lead frame. At present, substrate with ball grid array is often preferred as the market trend for more pin counts requisition. Qfn is a lead frame based package which is also called csp chip scale package with the ability to view and contact leads after assembly. Higher io density compared to qfn high design flexibility bgalga. In this paper, a new and advanced design of leadframe is discussed and presented with improvement in.
Yet, the cost of substrate is significantly higher than leadframe. A new configurable sintered interconnect qfn package for high performance, high lead count and low cost applications. Flat noleads, also known as micro leadframe mlf and son smalloutline. Qfn is a lead framebased package which is also called csp chip scale. The name leadframe or leadframe is actually very accurate. Lead frame material which allows traces to be routed through etching process higher io density compared to qfn high design flexibility bgalga utacs new generation of leadframepackage design grid array qfn gqfn. Thermal performance is an important aspect of any power converter design. I have a qfn package which, it turns out, has the lead frame exposed on the underside of the device.
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